CAPABILITIES
Based on the wide variety of skills and capabilities offered by the xVI team and our access to a broad range of fabrication facilities, we are able to provide our clients with an extensive
Engineering & Integration:
- Complete Process Review & Design for Manufacture (DFM)
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Nanofabrication:
- Lithography (E-Beam, Optical)
- Wet & Dry Etch (RIE, DRIE, ICP RIE)
- Deposition (Evap., Sputtering, LPCVD, PECVD)
- Focused Ion Beam (FIB) milling & CMP
- Advanced Packaging:
- Device Hybridization (Integrated & Flip Chip)
- Engineered Substrates
- Bonding (Wafer, Die & Wire)
- Integrated Circuits (Photonic & 3D Interconnects)
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Thermal Management:
- Computational Fluid Dynamics (CFD)
- Cooling Integrated Devices
- Micro-Channel Coolers (MCC)
- CTE Matched Materials & Diffusion Bonding
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Precision Machining & Assembly:
- Precision CNC Milling & Turning
- Advanced Materials
- Precision Wire EDM
- Fabrication & Assembly
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